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Computex 2015 - Rockchip has just unveiled its new "world's lowest power Wi-Fi technology," boasting an 85% power decrease for Internet of Things (IoT) devices when compared to predecessors and claiming it to provide similar power figures to Bluetooth 4.0 LTE.
The patented RKi6000 chip out of this Chinese company was announced during a stint at Computex 2015, with Rockchip stating that its new device uses around 20 mAh of power during use across a more convenient platform than the often range-limited Bluetooth 4.0 option.
There is also the added feature of 'Adaptive Dynamic Power Control Technology' which claims to adjust the chip's power configuration depending on data transmission requirements at any given time. Allowing for a better overall power consumption model when in stand-by or low-use situations.
Self-quoted as the "world's first high-performance Accelerated Processing Unit (APU) in a System-on-Chip (SoC) design" and previously known as the codename "Carrizo," this 6th generation AMD A-Series chip claims to be the most versatile notebook processor on the market.
Adding to the world first claim list is "the world's first High Efficiency Video Coding (HEVC) hardware decode support for notebooks, the first Heterogeneous Systems Architecture (HSA) 1.0-compliant design, and the first ARM TrustZone-capable high-performance APU," as mentioned in the release. These claims sit alongside specifications including a 12 compute core design, with four of those for the CPU and eight GPU - involving AMD "Excavator" cores and third generation AMD graphics cores.
Boasting double the speed of its competitors and twice the battery life of the previous model, this chip is tailored towards a Windows 10 experience and DirectX 12 usage.
It looks like manufacturers want AMD new chip, code-named Carrizo, to appear in laptops powered by Microsoft Windows 8 and Windows 10 - and not in Chromebooks. The news was confirmed by AMD marketing manager Adam Kozak, with OEMs likely excited to utilize Carrizo for gaming, video entertainment, and more.
The Carrizo is AMD's 6th generation AMD A-Series processor designed with core performance improvements, better gaming functionality, and other increased support for hardware-intensive activities. This is a great move by AMD as the company hopes manufacturers and consumers become fans of its latest accelerated processing unit offering.
Some laptops running Windows 8.1 and powered by Carrizo will launch in early July, with other products slated later this year using Windows 10. AMD designed Carrizo to help shake up laptops in the $400-$700 price range, which appears to be the consumer sweet spot.
Computex 2015 - On the industry side of things, Analogix Semiconductor, Inc. has just announced the release of its new ANX74xx product line set out to integrate everything needed to add USB Type-C into a smartphone, tablet, notebook or wearable device.
The vice president of marketing from Analogix, Andre Bouwer, says that "over time, the full-featured USB-C cable will replace HDMI cables, and indeed all USB cables, to become the ubiquitous way to transfer power, data and video," marking a major shift in technology trends globally.
This USB Type-C controller offers power delivery of up to 100w battery charging, data transfer in the form of SuperSpeed USB 3.1 generation 1 (5Gbps) and video display resolution support of 4K UHD and 8K.
In a recently issued press release AMD claims that its new A10-7870K APU "delivers a best-in-class experience for eSports and online gaming with superior performance," adding that this "new processor also delivers exceptional performance in modern workloads and is designed for the future with Microsoft Windows® 10."
Backed by 12 cores comprised of 4 CPU and 8GPU, this processor will has now hit the market at a small price of $137.
Aiming to allow gamers to play "like a pro without spending like one," AMD's corporate VP and general manager, Mat Skynner, is confident in this release.
The race of smaller nodes is quite exciting, with Apple reporting tapping TSMC for its future 10nm processors. We could expect TSMC to handle all of Apple's future A10 processors, which should hit production towards the end of the year.
TSMC will reportedly test out at 10nm pilot line within its 12 factories located in Hsinchu, with the company already starting a semiconductor intellectual property program, where it will partner up with other clients as we get deeper into 2015. With Samsung announcing 10nm production for 2016, the South Korean giant might be falling behind its competitors.
Sources of UDN have stated that the factory locations of TSMC that are working on 10nm are incredibly important to the Taiwanese manufacturer if it wants to secure a super client like Apple. If TSMC can indeed get its 10nm node production up to scratch in time, Samsung might lose out in its future contracts to Apple for the A10 processor.
I really have to stop reading about Intel's upcoming Xeon platforms, as I'm just going to disappoint myself that I'll never own one. The chipmaker is teasing its next-gen Xeon Skylake platform: Purley. The new architecture is going to be quite the leap over the current generation, with support for 6-channel DDR4, up from the quad-channel DDR4 support we have today.
Skylake Purley will be one of the biggest updates to the Xeon platform in quite a long time, with Skylake EX Purley supporting not just 6-channel DDR4, but up to eight processors that support 28 cores per chip, too. We also have the AVX 512 instruction set that will include the 100G OmniPath interconnect.
The OmniPath interconnect is something you've probably never heard of before, which is something that will be called Storm Lake. The PCH itself will be codenamed Lewisburg, with it sporting updated Ethernet controllers. The TDP that Skylake EX Purley processors will have will be between 45W and 165W, with CPUs slotting into something called Socket P. Another major update to the platform will see the number of PCIe slots increased to 48, with x4, x8 and x16 divisions allowed, which is a big upgrade to the platform.
Intel has already teased that it will begin talking about its plans for 10nm later this year, but rival Samsung has said that it plans to ramp up its 10nm production sometime in 2016.
Samsung has confirmed that the smaller node will be in "full production" sometime in 2016, but other than that, it was very coy about its plans. With Intel expected to be the first to 10nm, its rivals are now playing catch up, with 2016 being the year of 10nm technology. TSMC isn't far behind with 10nm, either.
The South Korean electronics giant has also confirmed that its 14nm FinFET technology is being made in four foundries, with two of them located in South Korea, and two of them in the United States.
Intel has said that the development of its 10nm technology is coming along well, with the chipmaker to begin talking about its plans for the future using 10nm later in the year.
President of Intel, Renee James, said during a recent Q&A session with stockholders at Intel's annual meeting: "The 10nm development is progressing very well. You will start to see start-up cost in the second half of the year on 10nm. We will talk about the timing of [10nm] later this year - the early part of next year about when that will happen".
We don't know much about Intel and its 10nm manufacturing process, but the company is wanting to increase transistor density, while reducing per transistor cost. This is something that other companies have failed to do with their shift into 14nm and 16nm FinFET processes, but Intel will hopefully see much more success with its 10nm technology.
Samsung is currently sitting at 14nm technology inside of its Galaxy S6 and Galaxy S6 edge smartphones, but we won't stay there for long if ARM has any say in the matter.
ARM is reporting set for the Ares core to hit just 10nm, something that will "reach smartphone and tablet makers by the end of next year". Ares will be here first with 10nm, but ARM is already teasing its successor: Prometheus. Prometheus will consume just 600-750mW of power, but Linley Gwenapp from analyst firm The Linley Group, believes that Ares will still have a place in the world.
Gwenapp said: "Ares core could reach smartphone and tablet makers by the end of next year. ARM is already well advanced on a next-generation high-end CPU that will follow the A72. In fact, this project is so far along that the A72 team could 'steal' some portions of the next-generation design. For example, a new floating-point unit reduces latency by 33%. The prefetcher, also from the next-gen design, improves the data-cache hit rate to boost performance. The next-gen branch predictor reduces mispredictions by 20%".